Terminology and detailed material specifications:

T_g - Glass Transition Temperature

Temperature point at which a glassy solid changes to an amorfous resin / epoxy

- if temperature exceeds T_g:
1. expansion of the material is growing rapidly in the direction of Z axis
2. mechanical material properties degrade rapidly (strength, bonds in the material)

T_d - Decomposition Temperature

Temperature at which there is a 5% weight loss of resin / epoxy

- if temperature exceeds T_d:
1. irreversible destruction in material occurs due to breach of chemical bonds in resin / epoxy

T260/T288

Measures time to delamination at specific temperature (i.e. 260°C/288°C)

CTE – Coefficient of Thermal Expansion

Dimensional increasing of the material in the X-, Y-and Z-axis by change of temperature at a constant pressure

CAF – Conductive Anodic Filament

Migration of copper ions through an enclosed moisture in the material, which can over time cause a short circuit

	Isola DE 104	Isola IS410	Isola 370HR
IPC-4101C Spec	21	21/24/26/28/121/124	21/24/26/98/99/101/126
Tg Glass Transition Temperature by DSC, spec minimum [°C]	135	175	175
Td Decomposition Temperature @ 5% wt loss [°C]	315	350	340
T260 Mins	12	50	60
T288 Mins	-	>10	30
CTE, Z-axis Pre Tg	70	65	45
% Z-Axis Expansion (50-260C)	4.2	3.5	2.8
CTE, Z-axis Post Tg	250	250	230
CTE, Pre Tg X, Y	16/13	13/14	13/14
CTE, Post Tg X, Y	14/7	15/17	14/17
Thermal Conductivity	0.36	0.5	0.4
Thermal Stress 10 Sec @ 288°C (550.4°F), spec min	pass	pass	pass
Permittivity (Dk) 100 MHz HP4285A	4.46	3.96	4.24
Permittivity (Dk) 1 GHz HP4291A	4.37	3.9	4.17
Permittivity (Dk) 2 GHz Bereskin Stripline	4.35	3.97	4.04
Permittivity (Dk) 5 GHz Bereskin Stripline	4.32	3.87	3.92
Permittivity (Dk) 10 GHz Bereskin Stripline	3.59	3.87	3.92
Loss Tangent (Df) 100 MHz HP4285A	0.02	0.0149	0.015
Loss Tangent (Df) 1 GHz HP4291A	0.022	0.0189	0.0161
Loss Tangent (Df) 2 GHz Bereskin Stripline	0.023	0.02	0.021
Loss Tangent (Df) 5 GHz Bereskin Stripline	0.024	0.023	0.025
Loss Tangent (Df) 10 GHz Bereskin Stripline	0.02	0.023	0.025
Volume Resistivity (After moisture resistance)	1.3x10⁶	5.0x10⁸	3.0x10¹⁰
Volume Resistivity (At elevated temperature)	3.4 x10⁷	3.6 x10⁵	7.0 x10⁸
Surface Resistivity (After moisture resistance)	1.0x10⁶	8.0x10⁵	3.0x10⁸
Surface Resistivity (At elevated temperature)	7.0x10⁸	4.5x10⁸	2.0x10⁸
Dielectric Breakdown, spec minimum	>50	>50	>50
Arc Resistance, spec minimum	120	129	115
Electric Strength, spec minimum (Laminate & prepreg as laminated)	54 (1350)	44 (1100)	54 (1350)
Comparative Tracking Index (CTI)	2 [250 - 399]	3 [175 - 249]	3 [175 - 249]
Peel Strength Low profile Cu foil, very low profile u2013 all Cu >17um	6.5(1.14)	7 (1.23)	6 (1.05)
Peel Strength Standard profile copper - After thermal stress	7 (1.23)	7 (1.23)	9 (1.58)
Peel Strength Standard profile copper - At 125°C (257°F)	6.5(1.14)	6.5(1.14)	7 (1.23)
Peel Strength Standard profile copper - After process solutions	7 (1.23)	7 (1.23)	9 (1.58)
Flexural Strength Lengthwise direction	89.00	79.00	90.00
Flexural Strength Crosswise direction	70.00	68.00	77.00
Moisture Absorption, spec maximum	0.3	0.2	0.15
Flammability (Laminate & prepreg as laminated), spec min	V0	V0	V0
HWI	0
Max Operating Temperature (MOT) [°C]	130	130 (150)	130 (150)
DSR	yes	yes	yes