Epoxy filled and capped via holes


SQP International is equiped with technology from I.T.C. Intercircuit Electronic GmbH

Technology for epoxy filling:

Power Squeegee PS 200 from I.T.C. Intercircuit Electronic GmbH
Power Squeegee PS 200 ®

The Power Squeegee – PS200 is designed for via hole fill on high aspect ratio boards.

Technology for removing epoxy filling:

Wet Grinder PD50 from I.T.C. Intercircuit Electronic GmbH
Plane Razing Device – PD 50 ®

Requirement for wet grinding arrised from the thermal requirements of particularly thin printed circuit boards and very sensitive base materials. Great emphasis is placed on accurate as possible grinding results.

Microsections - Filled and Capped Holes (Click on picture to see detail):
Filled and Capped Via holes
Filled and Capped Via holes
Filled and Capped Blind holes, sequential lamination
Filled and Capped Blind holes, sequential lamination
Filled and Capped Blind holes, sequential lamination
Filled and Capped Blind holes, sequential lamination
Filled and Capped Via holes detail
Filled and Capped Via holes detail
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