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Terminology and detailed material specifications:

 


Tg - Glass Transition Temperature
Temperature point at which a glassy solid changes to an amorfous resin / epoxy

- if temperature exceeds Tg:
1. expansion of the material is growing rapidly in the direction of Z axis
2. mechanical material properties degrade rapidly (strength, bonds in the material)

Td - Decomposition Temperature
Temperature at which there is a 5% weight loss of resin / epoxy

- if temperature exceeds Td:
1. irreversible destruction in material occurs due to breach of chemical bonds in resin / epoxy

T260/T288
Measures time to delamination at specific temperature (i.e. 260°C/288°C)
CTE – Coefficient of Thermal Expansion
Dimensional increasing of the material in the X-, Y-and Z-axis by change of temperature at a constant pressure
CAF – Conductive Anodic Filament
Migration of copper ions through an enclosed moisture in the material, which can over time cause a short circuit

   Isola DE 104 Isola IS410 Isola 370HR
IPC-4101C Spec 21 21/24/26/28/121/124 21/24/26/98/99/101/126
Tg Glass Transition Temperature by DSC, spec minimum [°C] 130 175 175
Td Decomposition Temperature @ 5% wt loss [°C] 330 350 340
T260 Mins 60 50 60
T288 Mins >5 >10 30
CTE, Z-axis Pre Tg 50 65 45
% Z-Axis Expansion (50-260C) 3 3.5 2.8
CTE, Z-axis Post Tg 250 250 230
CTE, Pre X, Y 13 13/14 13/14
CTE, Post Tg X, Y 14 15/17 14/17
Thermal Conductivity 0.4 0.5 0.4
Thermal Stress 10 Sec @ 288°C (550.4°F), spec min pass pass pass
Permittivity (Dk) 100 MHz HP4285A 4 3.96 4.24
Permittivity (Dk) 1 GHz HP4291A 4 3.9 4.17
Permittivity (Dk) 2 GHz Bereskin Stripline 4 3.97 4.04
Permittivity (Dk) 5 GHz Bereskin Stripline 4 3.87 3.92
Permittivity (Dk) 10 GHz Bereskin Stripline 3.59 3.87 3.92
Loss Tangent (Df) 100 MHz HP4285A 0.02 0.0149 0.015
Loss Tangent (Df) 1 GHz HP4291A 0.02 0.0189 0.0161
Loss Tangent (Df) 2 GHz Bereskin Stripline 0.022 0.02 0.021
Loss Tangent (Df) 5 GHz Bereskin Stripline 0.02 0.023 0.025
Loss Tangent (Df) 10 GHz Bereskin Stripline 0.02 0.023 0.025
Volume Resistivity (After moisture resistance) 1.3x108 5.0x108 3.0x1010
Volume Resistivity (At elevated temperature) 3.4 x103 3.6 x105 7.0 x108
Surface Resistivity (After moisture resistance) 1.0x108 8.0x105 3.0x108
Surface Resistivity (At elevated temperature) 7.0x108 4.5x108 2.0x108
Dielectric Breakdown, spec minimum >50 >50 >50
Arc Resistance, spec minimum 120 129 115
Electric Strength, spec minimum (Laminate & prepreg as laminated) 54 (1350) 44 (1100) 54 (1350)
Comparative Tracking Index (CTI) 2 [250 - 399] 3 [175 - 249] 3 [175 - 249]
Peel Strength Low profile Cu foil, very low profile u2013 all Cu >17um 6.5(1.14) 7 (1.23) 6 (1.05)
Peel Strength Standard profile copper - After thermal stress 7 (1.23) 7 (1.23) 9 (1.58)
Peel Strength Standard profile copper - At 125°C (257°F) 6.5(1.14) 6.5(1.14) 7 (1.23)
Peel Strength Standard profile copper - After process solutions 7 (1.23) 7 (1.23) 9 (1.58)
Flexural Strength Lengthwise direction 89.00 79.00 90.00
Flexural Strength Crosswise direction 70.00 68.00 77.00
Moisture Absorption, spec maximum 0.3 0.2 0.15
Flammability (Laminate & prepreg as laminated), spec min V0 V0 V0
HWI 0    
Max Operating Temperature (MOT) [°C] 130 130 (150) 130 (150)
DSR yes yes yes